Solder Joint Reliability: Theory and Applications
| Author | : | |
| Rating | : | 4.52 (600 Votes) |
| Asin | : | 0442002602 |
| Format Type | : | paperback |
| Number of Pages | : | 631 Pages |
| Publish Date | : | 2014-06-25 |
| Language | : | English |
DESCRIPTION:
New handbooks have been published to help both the neophyte and seasoned packaging engineer.. There has been a marked increase in university research related to solder. Assembly of micropassive discrete devices that are hardly visible to the unaided eye, of silicon chips directly to ceramic and plastic substrates, and of very fine peripheral leaded packages constitute a few of solder's uses. Solders have given the designer of modern consumer, commercial, and military electronic systems a remarkable flexibility to interconnect electronic
"Required reading in understanding solder joint fatigue" according to A Customer. In depth treatment of solder joint reliability. Excellent text for those attempting to understand the solder joint metalurgy and life calculation.Detail can be mind-numbing, but all the material includes high level information as well as all the gritty details.A must for the . Still missing information Amazon Customer Very good book, but still is missing some information, Specially in fluxes, I found there a big challenge for the author